Next-Level PCB Design:                                                                                         View In Browser https://marketing.sunstone.com/cr/AQix0RUQwb4tGOf3qZABVMl77xVWBdlHt2fovkO4SmZ1a1huMRbXfGMhHiwGnkQ

Ready for What’s Next in PCB Design? Learn Ultra HDI Techniques

As PCB designers, we know that traces are just one piece of the puzzle. To truly optimize performance and manufacturability, we need to think about vias, copper filling, and soldermask capabilities—critical elements that can make all the difference in your designs.

In This Webinar, You'll Learn:

Via Structures - Choosing the right vias for signal integrity and thermal management.
Copper Filling of Vias - When and why to use copper-filled vias for better electrical and mechanical properties.Soldermask & Fine Mask Capabilities - How precise soldermask design impacts manufacturability and reliability.

Whether you’re an experienced designer or just getting started, this session will provide valuable insights and practical tips to help you create stronger, more efficient, and manufacturable PCBs.

Date: June 18th, 2025

Time: 9:00 AM Pacific Time (US and Canada)
Location: Online - Comfort of Your Own Chair

Register Now ( https://marketing.sunstone.com/c/AQix0RUQwb4tGOf3qZABIPXgpQuVPVyWNfCrOx7uENKOo_nJqnVtAuNZC7t6rUWtOz5UOw )

Contact Sunstone Support
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